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The Company
Overview
Production Facilities
INTRACOM TELECOM is strategically positioned in the European Market as a high performance, flexible volume, and low-cost electronics manufacturer.
INTRACOM TELECOM's manufacturing capabilities cover the entire spectrum of mass production operations: PCB assembly, wiring and cabling, mechanical assembly, testing (PCB continuity, In-Circuit, PBA functional, final product functional), final assembly, and environmental testing (thermal cycling, vibration).
Existing production lines have been designed for optimum product flow. The total available space is roughly 10,000 m2. Facilities are spread among four production plants.
The manufacturing flow is designed with critical control points, where the product and process is monitored and tested with computer assisted techniques for specification compliance and the reduction of rejections to PPM levels.
The Industrial Engineering department has acquired considerable expertise in achieving high quality results with minimum cost by effectively designing and selecting production techniques, product flow, and the transportation of the product on the shop floor.
The full operational functionality and the reliability of every product are assured and validated through a series of testing and measurement procedures conducted during each phase of the production process. The Company operates a fully competent and qualified Equipment Testing department, furnished with all necessary industrial fixtures, know-how, and expertise. The Equipment Testing department further develops its own advanced and modern testing devices (Testers) to cover all the required inspection processes that are necessary for every manufactured product.
INTRACOM TELECOM's current capabilities are continually upgraded and updated through the company's vigorous investment program that includes the purchase of new manufacturing equipment and integrated manufacturing planning, scheduling and shop floor control systems.
Automatic Insertion of Components
- Plated through components
- Surface mounted components
- Robotics/odd components
CIM
- Integrated computerized environment of production support
Automatic Test & Inspection Equipment
- X-Ray 2D Inspection
- In-Circuit Testing
- Burn In Testing
- Functional Testing
- Final Testing
Printed Circuits Board Production
INTRACOM TELECOM established the Printed Circuit Board Plant to meet the requirements for high standard and fast turn-around production of prototype boards and limited quantities of multilayer boards. All production meets the IPC-600 standard. As part of its expansion into defence applications, the plant is progressing with certification under the MIL-PRF-55110F specification.
Product Development
The company responds to marketplace needs in the design of new products by employing the services of industrial designers and architects. The commercial production process of new products is often complex and includes preliminary stages of-the design of mechanical parts, the determination of structural element specifications, the compilation of required documentation, and the construction of testing equipment for products going into production.
Mechanical Prototype Construction
The development of reliable products requires the construction of numerous prototypes. By consistently testing these prototypes, compliance with design objectives can be verified and mechanical part errors can be identified and corrected before the production phase. By utilising precision-made prototypes the company can fully assess the product's efficiency, quality, performance, durability, and appropriate component fit.
INTRACOM TELECOM's mechanical operations lab uses CAD system interfacing CNC machinery to produce exact prototypes. The prototype lab meets company-wide prototype construction requirements for all the mechanical parts incorporated in INTRACOM TELECOM products, including advanced prototype die -casting, CNC machinery, and moulded sheet-metal parts. In cooperation with fully qualified Greek and EU universities, new mechanical part production technologies are tested using the lab's state-of-the-art machinery.
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